ButSpeak.com
News which Matters.
In a groundbreaking development, researchers from the University of Texas at Dallas (UTD) and the Seoul National University (SNU) have created a tiny chip capable of taking images through cardboard, bringing the dream of smartphone X-ray vision closer to reality. This innovative technology, designed to fit inside a smartphone, mimics Superman’s iconic ability to see through solid objects, but without the harmful effects of X-rays.
Revolutionary Technology
“This technology is like Superman’s X-ray vision,” said Kenneth O, professor of electrical engineering at UTD and director of the Texas Analog Center of Excellence (TxACE). “Of course, we use signals at 200 gigahertz to 400 gigahertz instead of X-rays, which can be harmful.”
The imaging microchip emits terahertz (THz) radiation, a safe and invisible form of electromagnetic radiation that lies between microwave and infrared frequencies. First demonstrated in 2022, this chip can penetrate obstacles like fog and dust, reflecting signals that are then captured by pixels to create an image.
Enhanced Image Quality and Portability
The initial 2022 model showed promise but lacked the resolution needed for practical applications. Researchers improved the image quality and miniaturized the technology to fit in handheld devices. The latest version features a 1 x 3 array of 296-GHz CMOS pixels, making it possible to capture detailed images without external lenses. The pixels, each the size of a grain of sand, detect signals reflected from objects, allowing for a compact and efficient design.
“We designed the chip without lenses or optics so that it could fit into a mobile device,” said Wooyeol Choi, assistant professor at SNU’s Department of Electrical and Computer Engineering.
Practical Applications and Safety Considerations
Tested at a close range of one centimeter for safety reasons, the chip successfully imaged objects like a USB dongle and a plastic washer covered with cardboard. This proximity ensures privacy and prevents misuse, such as scanning the contents of someone’s bag from afar. Future iterations aim to extend the imaging distance to up to five inches.
“It took 15 years of research that improved pixel performance by 100 million times, combined with digital signal processing techniques, to make this imaging demonstration possible,” noted Brian Ginsburg, director of RF/millimeter wave research at Texas Instruments (TI’s) Kilby Labs.
Broad Potential Uses
The researchers foresee numerous applications for this technology, from locating studs and beams behind walls to identifying cracks in pipes and examining the contents of packages. Medical applications are also on the horizon, promising further advancements in healthcare diagnostics.
Supported by the Texas Instruments (TI) Foundational Technology Research Program and the Samsung Global Research Outreach Program, this innovation marks a significant leap in imaging technology, blending practicality with futuristic capabilities.
Stay tuned for more updates on this remarkable tech that promises to transform how we see and interact with the world around us.
